Lian Li 2013 Preview from CES
Sean Gibson / Jan 25th, 2013 No Comments
Lian Li 2013 Preview
At the recent International CES in Las Vegas, we met up with our contacts from case manufacturer Lian Li. PC enthusiasts might remember that Lian Li is one of the more highly regarded case manufacturers around upgrade websites thanks to slick designs and their unique brushed aluminum cases. For those that take their PCs to high overclocked levels tend to be stout proponents of Lian Li cases thanks to the impressive thermal capabilities of aluminum cases. We met with PR guru Eric Zarshenas to talk about the new 2013 line of cases that Lian Li is releasing as well as get some insight into some of the new features the cases will have.
Sean (GI) : This is Sean Gibson, CES 2013 at the Lian Li booth. Could you introduce yourself and your role for the company?
Eric (Lian Li): Yes, my name’s Eric Zarshenas, and I am the PR agent for Lian Li.
Sean: We’ve seen some gorgeous black brushed aluminum cases here, looks likes there’s a lot coming in 2013 with Lian Li. Talk a little bit about some of the smaller form factors, mid form factors and what you think gamers will probably zero in on right away.
Lial Li Brushed Aluminum Case
Eric (Lian Li): We have a lot of small cases, you gamers would probably be interested in. If we’re going to go right into gaming, the first one I would say is the PC-Q28. This case is a LAN case also used as a NAS case. You can fit up to six SSDs or 3.5s in there, as well as full-range VGA cards, no problem. That’s mini ITX.
If you go a little bit bigger, up to ATX, Lian Li is going to put out another case this year, called a PC-X3. This is really gamer-focused and it’s going to be a lower price point than most Lian Li cases in the past. It’s going to be black sandblasted-front aluminum, brushed aluminum on the back, as well as black on the inside, which, you gamers, I know are a big fan of. Plenty of space for wiring in the back, as well as water cooling support.
Sean (GI): One thing I’ve noticed on some of the models is the motherboard mounting system has changed. Talk a little bit about what that is and the why?
Eric (Lian Li): A lot of cases, including the mini ITX all the way up to the EATX, have this railing system instead of just a motherboard tray. There are a couple reasons for this. The number one reason is for thermal issues, you don’t have the metal right on your motherboard, and metal when it gets hot, it stays hot for a long time. When you get air behind there, it will dissipate heat faster. Also if you look at it, on the back, you can guide your wires there and tie them up for cable management, there’s no bird’s nest.
Lian Li New Cases in 2013
Sean (GI): Lian Li, just as a company, always seems to refresh themselves just really well. What kind of competitive advantages do you think they hold over other case manufacturers?
Eric (Lian Li): Lian Li doesn’t have a manufacturer doing their cases for them, they do all the cases in-house. That means we can tweak designs, we can do what we want and we can release a lot of products in a lot of different niches to hit every target market. That’s what I would say is the best part about Lian Li and having all the manufacturing in-house.
Sean (GI): Also a gorgeous design.
Eric (Lian Li): Of course, of course, yes.
Sean (GI): Eric, thank you so much for joining us at Gaming Illustrated.
Eric (Lian Li): Yes, no problem, thank you.
A special thanks goes out to Eric Zarshenas and the Lian Li team for their time at CES.
Sean Gibson
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tags: 2013 ces , 2013ces , case , hardware , interview , lian li , pc , preview
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